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Electro Scientific Industries Inc ESIO.OQ (NASDAQ Stock Exchange Global Select Market)

18.42 USD
-- (--)
As of 1:30 AM IST
chart
Previous Close 18.42
Open --
Volume --
3m Avg Volume 210,905
Today’s High --
Today’s Low --
52 Week High 27.72
52 Week Low 8.44
Shares Outstanding (mil) 33.14
Market Capitalization (mil) 494.40
Forward P/E --
Dividend (Yield %) -- ( -- )

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RECOMMENDATION

Sell Hold Buy
1.50 Mean rating from 4 analysts

KEY STATS

Revenue (mm, USD)
FY18
368
FY17
161
FY16
184
FY15
159
EPS (USD)
FY18
3.248
FY17
-1.139
FY16
-0.392
FY15
-1.426
*Note: Units in Millions of U.S. Dollars
**Note: Units in U.S. Dollars

KEY RATIOS

Price to Earnings (TTM)
vs sector
--
24.37
Price to Sales (TTM)
vs sector
2.66
54.39
Price to Book (MRQ)
vs sector
3.39
2.70
Price to Cash Flow (TTM)
vs sector
--
16.31
Total Debt to Equity (MRQ)
vs sector
9.01
97.73
LT Debt to Equity (MRQ)
vs sector
9.01
75.33
Return on Investment (TTM)
vs sector
-19.58
7.31
Return on Equity (TTM)
vs sector
-21.55
12.58

EXECUTIVE LEADERSHIP

Richard Wills
Independent Chairman of the Board, Since 2015
Salary: --
Bonus: --
Michael Burger
President, Chief Executive Officer, Director, Since 2016
Salary: $287,500.00
Bonus: $287,500.00
Allen Muhich
Chief Financial Officer and Corporate Secretary, Since 2017
Salary: --
Bonus: --
John Williams
Vice President - Marketing, Since 2017
Salary: --
Bonus: --
Steve Harris
Vice President - Engineering, Since 2017
Salary: --
Bonus: --

COMPANY PROFILE

Sector: Industrials
Industry: Electrical Components & Equipment
Address:

13900 NW SCIENCE PARK DR
PORTLAND   OR   97229

Phone: +1503.6414141

Electro Scientific Industries, Inc. and its subsidiaries supply laser-based manufacturing solutions for industries reliant on microtechnologies. The Company operates through two segments: Component Processing and Micromachining. The Component Processing segment includes interconnect products, semiconductor products and component products. The interconnect, semiconductor and component products are sold to manufacturers of electronic components and are used to drill, cut, trim, ablate and test and mark features for the functionality of the component. The Micromachining segment includes products that are sold to manufacturers of end devices across various industries and are used to drill, cut or mark features on a range of materials, generally on the casing or external surface of the end device. Its integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials. It has operations in Asia, Europe and North America.

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